Practical Electron Microscopy and Database

An Online Book, Second Edition by Dr. Yougui Liao (2006)

Table of Contents/Index

Chapter/Index: Introduction | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | Appendix

B-centered lattices/B-centering
Back focal plane of objective lens in EMs			Back focal plane of projector lens in TEM
Background
Background contrast in TEM/STEM images			Background of electron diffraction pattern in TEM
Background in EELS & EFTEM			Background variation in EELS and EFTEM due to composition variation in materials
Background in EDS map and profile & its corrections
X-ray peak to background ratio in EDS			Background shelf in EDS measurements
Backscattering electrons (BSEs)
Coefficients of elastic backscattering electrons			Coefficients of inelastic backscattering electrons
Dependence of BSEs on atomic number			Backscattering electrons from scintillator in EMs
Backscattering coefficient (yield) of electrons			Separating BSEs from SEs in SEM
Evaluation of grain orientations based on electron backscattering			Interaction volumes for generation of BSEs
Backscattered Kikuchi diffraction (BKD)			Backscattered electron detector
Electron backscattering affected by accelerating voltage			Backscattered electron imaging affected by accelerating voltage of electron beam
EDS signal affected by secondary and backscattered electrons			Comparison between backscattered electron & secondary electron imagings
Yield of backscattering electrons in EM
Intensity of backscattering electrons (BSEs) depending on TEM sample thickness			Fraction of backscattered electrons depending on sample thickness

Bamboolike microstructure in interconnects in ICs			Band structure (BS) methods used in EELS modeling
Bandgap of solids
Bandgap energies of semiconductor materials and dielectrics			Direct bandgap
Indirect bandgap			Bandgap energies of dielectrics
Determination of band gap from low-loss spectra in EELS

Bandpass mask annotation on Gatan DigitalMicrograph
Barium (Ba)
Ba_1-pCr₂X_4-p (X = S, Se)			Doped and undoped BaTiO₃
La_2-xBa_xCuO₄			Atomic number contrast of barium (Ba)
EDS and WDS measurements of barium (Ba)			EELS measurement of Barium (Ba)
Barrier layer in contacts in ICs
Copper (Cu) interconnects with tantalum (Ta) barrier			Copper (Cu) with dielectric diffusion barrier SiC_xN_y
Barriers for copper interconnections			Titanium nitride (Ti₂N/TiN) barrier layer

Barrier heights at electrical contacts
Base-centered orthorhombic structure			Basis/motif/lattice point
Batteries
Comparison between different batteries
Batteries: Lithium Ion Batteries
Negative (anode) & positive (cathode) electrode materials for lithium batteries			Rechargeable lithium ion batteries
Lithium-titanium-oxide anodes for batteries			Silicon (Si) alloying anodes in lithium batteries
Graphite as negative electrodes in lithium batteries			Dimethylacetamide (DMAc)

Bayonet Neill–Concelman (BNC) connector
BCC (body-centered-cubic) structure
Standard indexed diffraction patterns for bcc crystals			BCC structure at grain boundaries in FCC materials
bcc-type packing short range ordering of metallic glasses			Diffraction comparison between different cubic crystal structures

Body-centered (I) lattices			Body-centered orthorhombic (BCO) structures
BCT (body-centered-tetragonal) structure (C11_b )
bct-type packing short range ordering of metallic glasses
Beam/probe current and its current density
Measurement of probe current			Dependence of electron probe/beam current on probe size in EMs
Optimized electron beam current for EELS/EFTEM measurements			Electron Beam Testing (EBT)
Pulsed electron beam in electron microscopy
Beams
Beam blanking with an electrostatic deflector in EMs and FIB			Beam tilt with dark-field deflection coils
Beam trap aperture in GIF camera			Beam energy broadening in EMs
Beam size broadening in EMs			Beam-defining aperture
Bell-shaped field (Glaser’s “Glockenfeld”) in EMs			Beam stopper in TEM
Multi beam inspection tool from ASML
Beam tilt & shift and their purities/pivot point/rocking point in TEM
Diffraction variation due to beam tilt in TEM			Beam-tilt induced effects in TEM
Aberration determinations by image shift due to tilting illumination			Wobbler for coma-free alignment with beam tilt
Beam/probe size in EMs
Evaluation of beam size in EMs			Lenses for fine probe/beam formation in EMs
Electron spot/beam size and shape limited by diffraction			Spot/beam size and shape limited by aberrations
Minimum attainable probe size in STEM
Beer’s absorption law in EDS measurement			Beer’s absorption law in TEM/STEM measurements
Bend
FIB/ion-irradiation-induced bending
Beryllium
Beryllium nitride			Beryllium borides
EELS measurement of beryllium (Be)			TEM specimen grids for EDS analysis
EDS-TEM specimen holders			Beryllium `window' EDS detector
Be-based metallic-glass alloys
Best
Best research-cell efficiencies for solar cells			Best defocus condition for HRTEM imaging
Bethe cross section
Bethe stopping power (or Bethe equation)			Two-beam Conditions/first Bethe approximation in TEM Measurements
Bias electrode in electron guns
Bias-induced contrast/intensity effect in SEM

Binary-encounter-Bethe (BEB) method for cross section calculation			Binocular in TEMs
Binding energy
K-shell binding energy			Binding energy measurement by EELS
Difference of binding energies in amorphous and crystalline phases
Binning in CCD
Binning/binned pixel/super pixel in CCD			Spatial resolution affected by CCD binning process
Noise reduction by binning in CCD			Binning versus saturation/exposure time in CCD camera
Degradation of EELS and EFTEM energy resolution due to binning			Bremsstrahlung X-rays
Biological electron microscopy (EM)
Point groups of crystals of biological macromolecules			EM analysis of biological materials
Low voltage EMs in biological applications			TEM designs for biological applications
TEM imaging on biological materials			Biological TEM specimen
In Situ liquid TEM/STEM analysis			Cryo-focused ion beam (FIB)
High pressure freezing (HPF) for TEM sample preparation
Bijvoet (or Friedel) pair & Friedel's law			Bipolar resistive switching in perovskite insulators
Biprism
Möllenstedt–Düker biprisms in optical and electron microscopes			Fiber/biprism filament in Möllenstedt–Düker biprism for off-axis electron holography
Bismuth (Bi)
EDS measurement of bismuth (Bi)
Misfit layer chalcogenides: (AX)_1+δ(BX₂)_n (A = rare earth/Sn/Pb/Sb/Bi; B = Ti/V/Cr/Nb/Ta; X = S/Se)			Phase diagrams of Bi-X
Bloch-wave
Electron diffraction formation: Bloch-wave approach			Bloch’s theorem
Bloch electrons			Bloch wave approaches for simulating TEM images

Boersch effect			Block crystalline structures
Bmab(Abma, Cmca, 64) space group			Box (rectangle) annotation on Gatan DigitalMicrograph
Blooming/smearing in CCD			Blurring effect/contrast delocalization in TEM images
Bond pad in IC-devices
Bond pad contamination in IC-devices
Bond: Chemical bond
Difference between bond lengths of amorphous and crystalline materials			O^2- coordination and bond strength
Bond strength/bond energy			Relationship between bond energy and melting point
Bonding-type substances
Ionic bonding-type substances			Covalent bonding-type substances
Metallic bonding-type substances			van der Waals bonding-type substances
Hydrogen bonding-type substances

Born series/first-order Born approximation
Boron (B)
EDS measurements of boron (B)			EELS measurements of boron (B)
STEM imaging of boron			Beryllium borides
BCl₃			MgB₂
Boron nitride (BN)
Boron carbide			B-based metallic-glass alloys
Boundaries
Twinning and twin boundaries
Bragg condition/law/Bragg scattering/Bragg's law/Bragg angle
Bragg spots in CBED			Excitation error of the Bragg reflections

Bravais lattices			Bottom-hat filtering and top-hat filtering
Bremsstrahlung X-rays
Cross section for bremsstrahlung production

Bridging/spiking failure in ICs
Bright-field (BF) imaging in TEM
Power spectra of bright-field (BF) TEM micrographs			Comparison between TEM and STEM bright field imagings

Brightness of electron gun/illumination in EMs			Bright field (BF) detectors in TEM/STEM
Brillouin zone			Annular bright-field measurements
Comparison between BF (bright field), ADF (annular dark field) and HAADF (high angle annular dark field) STEM images
Broadening/spreading
EELS resolution affected by beam broadening in TEM specimen
Broadening of diffraction peak & phonon-electron scattering			Beam energy broadening in EMs
Broadening of EELS zero-loss peak due to phonon scattering			Electron beam size broadening in TEM/STEM/SEM specimen
Core-loss peak broadening in EELS			Chromatic and spherical aberrations & beam spread/convergence
Effect of beam spreading on EDS spatial resolution			Zero-loss peak in EELS and its broadening/width
Beam spreading in STEM caused by chromatic aberration			Spatial resolution/beam spreading in STEM depending on convergence semiangle
Point-spread and its function in imaging system			Broadening of diffraction intensities depending on grain size
Lattice-fringe visibility & its band & band broadening			Broadening of EDS peaks
Electron-Beam-Probing (eBP)			Comparison between Electron-Beam-Probing (eBP) and Laser Voltage Imaging/Probing (LVI/LVP)
Electron Voltage Imaging (EVI) and Electron Voltage Probing (EVP)
Bromine
IBr

Bubble/void/hole in materials			Built-in electric field/potential at material surface due to electron irradiation
Built-in potential in p-n junction
Bulk
Difference of atomic structure between surface, interface, and bulk			Surface & bulk plasmon energy in EELS (theory)
Surface & bulk plasmon energy in EELS (table)			Energy level diagrams for single atoms, dimers, clusters & bulk materials
Bulk defects in materials
Burgers vector
Determination of Burgers vectors of dislocations			Tables of Burgers vectors of dislocations
Determination of Burgers vector of lattice defects			Burgers circuit & finish-start/right-hand (FS/RH) convention
Determination of Burgers vector of fcc lattice defects			Tables of Burgers vectors of defects in hexagonal structures
g·b analysis (visibility criterion) for analysis of Burgers vector and dislocations			Application of g·b Analysis (Visibility Criterion: Dot product of the diffraction vector g and the Burgers vector b)
Buy/purchase/buy/sales/service of EM systems			Purchase/buy/sale/service of TEM systems and acceptance specifications of new systems