Tantalum (Ta) in ICs
- Practical Electron Microscopy and Database -
- An Online Book -


This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.


Table 2006. Metallization selections in ICs.

Gates, interconnection, and
Polysilicon, refractory metal silicides (e.g. MoSix, TaSix, WSix, and TiSix), nitrides,aluminum, copper, and/or refractory metals.
Diffusion barrier layer
Ti, TiN, Ta, TaN, Ti-W alloy, and/or silicides
Top level
Aluminum, and/or copper
Metallization on silicon
Silicides, tungsten, aluminum, and/or copper





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