Gold in ICs
- Practical Electron Microscopy and Database -
- An Online Book -

http://www.globalsino.com/EM/  



 
This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
 

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In integrated circuits (ICs), conductive lines provide electrical interconnection among different parts of the ICs, devices, and the outside. The main applications of metallization are classified by gate, contact, and interconnection. Polysilicon and silicides are commonly applied as gates and interconnects in MOS devices. Aluminum, copper, tungsten, silver, titanium, platinum, gold, and palladium are used as these types of contacts, connections, and/or interconnection to external components.

Table 2029. Properties of some metals commonly used in ICs.

Property\metal
Cu
Al
W
Au
Ag
Resistivity (10-6 Ω•cm)
1.67
2.66
5.65
2.35
1.59
Melting point (°C)
1085
660
3387
1064
962
Thermal conductivity (Wcm-1)
3.98
2.358
1.74
3.15
4.25
Thermal stress per degree for
films on silicon (107 dyn cm-2 °C-1)
2.5
2.1
0.8
1.2
1.9
Coefficient of thermal expansion (CTE)
(10-6 °C-1)
17
23.5
4.5
14.2
19.1
Youngs modulus (x10-11 dyn cm-2)
12.98
7.06
41.1
7.85
8.27
Corrosion in air
Poor
Good
Good
Excellent
Poor
Specific heat capacity(Jkg-1K-1)
38
917
138
132
234
Adhesion to SiO2
Poor
Good
Poor
Poor
Poor

 

 

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