Chapter/Index: Introduction | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | Appendix
| Table 2425. Wafer cleaning chemistry in IC fabrications.
The chemical dry-cleaning (CDC) on Si substrates employs the byproduct [(NH4)2SiF6] with the following chemical reaction:
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|