Table of Contents/Index
Chapter/Index:
Introduction
|
A
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B
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C
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D
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E
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F
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G
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H
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I
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J
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K
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L
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M
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N
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O
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P
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Q
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R
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S
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T
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U
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V
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W
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X
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Y
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Z
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Appendix
Chapter B
B-centered lattices/B-centering
Back focal plane of objective lens in EMs
Back focal plane of projector lens in TEM
Background
Background contrast in TEM/STEM images
Background of electron diffraction pattern in TEM
Background in EELS & EFTEM
Background in EDS map and profile & its corrections
X-ray peak to background ratio in EDS
Background shelf in EDS measurements
Backscattering electrons (BSEs)
Coefficients of elastic backscattering electrons
Coefficients of inelastic backscattering electrons
Dependence of BSEs on atomic number
Backscattering electrons from scintillator in EMs
Backscattering coefficient (yield) of electrons
Separating BSEs from SEs in SEM
Evaluation of grain orientations based on electron backscattering
Interaction volumes for generation of BSEs
Backscattered Kikuchi diffraction (BKD)
Backscattered electron detector
Electron backscattering affected by accelerating voltage
Backscattered electron imaging affected by accelerating voltage of electron beam
EDS signal affected by secondary and backscattered electrons
Comparison between backscattered electron & secondary electron imagings
Yield of backscattering electrons in EM
Intensity of backscattering electrons (BSEs) depending on TEM sample thickness
Fraction of backscattered electrons depending on sample thickness
Bamboolike microstructure in interconnects in ICs
Band structure (BS) methods used in EELS modeling
Bandgap of solids
Bandgap energies of semiconductor materials
Direct bandgap
Indirect bandgap
Bandgap energies of dielectrics
Determination of band gap from low-loss spectra in EELS
Bandpass mask annotation on Gatan DigitalMicrograph
Barium (Ba)
Ba
1-p
Cr
2
X
4-p
(X = S, Se)
Doped and undoped BaTiO
3
La
2-x
Ba
x
CuO
4
EDS and WDS measurements of barium (Ba)
Atomic number contrast of barium (Ba)
Barrier layer in contacts in ICs
Copper (Cu) interconnects with tantalum (Ta) barrier
Copper (Cu) with dielectric diffusion barrier SiC
x
N
y
Barriers for copper interconnections
Titanium nitride (Ti
2
N/TiN) barrier layer
Barrier heights at electrical contacts
Base-centered orthorhombic structure
Basis/motif/lattice point
Batteries
Comparison between different batteries
Batteries:
Lithium Ion Batteries
Negative (anode) & positive (cathode) electrode materials for lithium batteries
Rechargeable lithium ion batteries
Lithium-titanium-oxide anodes for batteries
Silicon (Si) alloying anodes in lithium batteries
Graphite as negative electrodes in lithium batteries
Dimethylacetamide (DMAc)
Bayonet Neill–Concelman (BNC) connector
BCC (body-centered-cubic) structure
Standard indexed diffraction patterns for bcc crystals
BCC structure at grain boundaries in FCC materials
bcc-type packing short range ordering of metallic glasses
Diffraction comparison between different cubic crystal structures
Body-centered (I) lattices
Body-centered orthorhombic (BCO) structures
BCT (body-centered-tetragonal) structure (
C11
b
)
bct-type packing short range ordering of metallic glasses
Beam/probe current and its current density
Measurement of probe current
Dependence of electron probe/beam current on probe size in EMs
Optimized electron beam current for EELS/EFTEM measurements
Beam blanking deflector in EMs and FIB
Beam tilt with dark-field deflection coils
Beam trap aperture in GIF camera
Beam energy broadening in EMs
Beam size broadening in EMs
Beam-defining aperture
Bell-shaped field (Glaser’s “Glockenfeld”) in EMs
Beam stopper in TEM
Beam tilt & shift and their purities/pivot point/rocking point in TEM
Diffraction variation due to beam tilt in TEM
Beam-tilt induced effects in TEM
Aberration determinations by image shift due to tilting illumination
Wobbler for coma-free alignment with beam tilt
Beam size in EMs
Evaluation of beam size in EMs
Lenses for fine probe/beam formation in EMs
Electron spot/beam size and shape limited by diffraction
Spot/beam size and shape limited by aberrations
Minimum attainable probe size in STEM
Beer’s absorption law in EDS measurement
Beer’s absorption law in TEM/STEM measurements
Bend
FIB/ion-irradiation-induced bending
Beryllium
Beryllium nitride
Beryllium borides
EELS measurement of beryllium (Be)
TEM specimen grids for EDS analysis
EDS-TEM specimen holders
Beryllium `window' EDS detector
Be-based metallic-glass alloys
Best
Best research-cell efficiencies for solar cells
Best defocus condition for HRTEM imaging
Bethe cross section
Bethe stopping power (or Bethe equation)
Two-beam Conditions/first Bethe approximation in TEM Measurements
Bias electrode in electron guns
Bias-induced contrast/intensity effect in SEM
Binary-encounter-Bethe (BEB) method for cross section calculation
Binocular in TEMs
Binding energy
K-shell binding energy
Binding energy measurement by EELS
Difference of binding energies in amorphous and crystalline phases
Binning in CCD
Binning/binned pixel/super pixel in CCD
Spatial resolution affected by CCD binning process
Noise reduction by binning in CCD
Binning versus saturation/exposure time in CCD camera
Degradation of EELS and EFTEM energy resolution due to binning
Biological macromolecules
Point groups of crystals of biological macromolecules
Biology applications of EMs
Bremsstrahlung X-rays
EM analysis of biological materials
Low voltage EMs in biological applications
TEM designs for biological applications
TEM imaging on biological materials
Biological TEM specimen
In Situ liquid TEM/STEM analysis
Cryo-focused ion beam (FIB)
High pressure freezing (HPF) for TEM sample preparation
Bijvoet (or Friedel) pair & Friedel's law
Bipolar resistive switching in perovskite insulators
Biprism
Möllenstedt–Düker biprisms in optical and electron microscopes
Fiber/biprism filament in Möllenstedt–Düker biprism for off-axis electron holography
Bismuth (Bi)
EDS measurement of bismuth (Bi)
Misfit layer chalcogenides: (AX)
1+δ
(BX
2
)
n
(A = rare earth/Sn/Pb/Sb/Bi; B = Ti/V/Cr/Nb/Ta; X = S/Se)
Phase diagrams of Bi-X
Bloch-wave
Electron diffraction formation: Bloch-wave approach
Bloch’s theorem
Bloch electrons
Bloch wave approaches for simulating TEM images
Boersch effect
Block crystalline structures
Bmab(Abma, Cmca, 64) space group
Box (rectangle) annotation on Gatan DigitalMicrograph
Blooming/smearing in CCD
Blurring effect/contrast delocalization in TEM images
Bond pad in IC-devices
Bond pad contamination in IC-devices
Bond:
Chemical bond
Difference between bond lengths of amorphous and crystalline materials
O
2-
coordination and bond strength
Bond strength/bond energy
Relationship between bond energy and melting point
Bonding-type substances
Ionic bonding-type substances
Covalent bonding-type substances
Metallic bonding-type substances
van der Waals bonding-type substances
Hydrogen bonding-type substances
Born series/first-order Born approximation
Boron (B)
EDS measurements of boron (B)
EELS measurements of boron (B)
STEM imaging of boron
Beryllium borides
BCl
3
MgB
2
Boron nitride (BN)
Boron carbide
B-based metallic-glass alloys
Boundaries
Twinning and twin boundaries
Bragg condition/law/Bragg scattering/Bragg's law/Bragg angle
Bragg spots in CBED
Excitation error of the Bragg reflections
Bravais lattices
Bottom-hat filtering and top-hat filtering
Bremsstrahlung X-rays
Cross section for bremsstrahlung production
Bridging/spiking failure in ICs
Bright-field (BF) imaging in TEM
Power spectra of bright-field (BF) TEM micrographs
Comparison between TEM and STEM bright field imagings
Brightness of electron gun/illumination in EMs
Bright field (BF) detectors in TEM/STEM
Brillouin zone
Annular bright-field measurements
Broadening/spreading
EELS resolution affected by beam broadening in TEM specimen
Broadening of diffraction peak & phonon-electron scattering
Beam energy broadening in EMs
Broadening of EELS zero-loss peak due to phonon scattering
Electron beam size broadening in TEM/STEM/SEM specimen
Core-loss peak broadening in EELS
Chromatic and spherical aberrations & beam spread/convergence
Effect of beam spreading on EDS spatial resolution
Zero-loss peak in EELS and its broadening/width
Beam spreading in STEM caused by chromatic aberration
Spatial resolution/beam spreading in STEM depending on convergence semiangle
Point-spread and its function in imaging system
Broadening of diffraction intensities depending on grain size
Lattice-fringe visibility & its band & band broadening
Broadening of EDS peaks
Bromine
IBr
Bubble/void/hole in materials
Built-in electric field/potential at material surface due to electron irradiation
Built-in potential in p-n junction
Bulk
Difference of atomic structure between surface, interface, and bulk
Surface & bulk plasmon energy in EELS (theory)
Surface & bulk plasmon energy in EELS (table)
Energy level diagrams for single atoms, dimers, clusters & bulk materials
Bulk defects in materials
Burgers vector
Determination of Burgers vectors of dislocations
Tables of Burgers vectors of dislocations
Determination of Burgers vector of lattice defects
Burgers circuit & finish-start/right-hand (FS/RH) convention
Determination of Burgers vector of fcc lattice defects
Tables of Burgers vectors of defects in hexagonal structures
Buy/purchase/buy/sales/service of EM systems