Chapter P |
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p-i-n structures |
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Applications of p-i-n structures in EM-related devices |
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p-n junction |
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Built-in potential in p-n junction |
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PVC of pn-junction structures/diodes |
p-well contacts and p-contacts in ICs |
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PVC of p-well contacts in ICs |
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PVC of n-contacts in p-well in ICs |
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PVC of p-contacts in n-well in ICs |
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Packaging |
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IC failure induced during wafer packaging and shipping |
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| Packing density in some crystal planes |
Packing factor (atomic) in crystals |
| Pair correlation function (PCF) |
Pair Distribution Function (PDF) analysis |
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EELS measurement of palladium (Pd) |
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EDS measurement of palladium (Pd) |
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SEM and STEM observation of Pd (Palladium) particles |
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Palladium in ICs |
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Pd-based metallic-glass alloys |
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Palladium oxide (PdO) |
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| Parabaloid method for image series reconstruction with TEM |
Parallax (film thickness) measurements |
| Parallel illumination in TEM |
Parallel: Comparison of microscope conditions with parallel and convergent beams |
| Paramagnetic materials |
Parallel EELS spectrometer (PEELS) |
| Parasitic aberrations in multipole corrector optics |
Paraxial ray focus |
| Paraxial rays (electrons) in EMs |
Partial coherence of electron source |
| Partial density of states (PDOS) |
Partial cross-sections for inner-shell ionization |
| Partial, total and integral cross-sections for inner-shell ionization |
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Particle & Nanoparticle |
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EDS artifact of measurement on (nano-) particles |
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Requirements and preparation of nano-particles TEM samples |
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SEM and STEM observation of Pd (Palladium) particles |
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Wave-particle duality |
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Killer particles causing IC failure |
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Particle analysis with DM and scripts |
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Requirements and preparation of nano-particles TEM samples |
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Positive charging case of PVC in FIB and SEM |
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Artifacts in PVC in FIB and SEM |
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Advanced mechanisms of PVC contrast |
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Negative charging case of PVC in SEM |
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Short failure in IC devices detected by PVC |
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PVC of pn-junction structures/diodes |
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PVC of gate contacts |
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PVC of n-well contacts in ICs |
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PVC of p-well contacts in ICs |
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PVC of n-contacts in p-well in ICs |
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PVC of p-contacts in n-well in ICs |
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Equivalent circuit diagram of PVC in FIB and SEM |
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Dependence of PVC generation on area and/or volume of connected conducting materials |
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PVC of transistors |
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PVC of capacitors |
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Optimized conditions for PVC observations |
Patches |
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Dark patches |
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| Pattern center determination in EBSD |
Patterson method |
| Patterson space group |
Pauli exclusion principle |
PC/remote application in EMs |
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Computer- & remote-control on electron microscopes |
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Data acquisition and analysis using PC in EMs |
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| Peak-detector/peak-stretcher in EDS systems |
Peak pile-up continuum in x-ray/EDS profiles |
Peak broadenings in EELS |
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Core-loss peak broadening in EELS |
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Broadening of EELS zero-loss peak due to phonon scattering |
Peak-to-background ratios |
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Peak-to-background ratio in EELS |
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| Peak splitting in XRD profiles |
Peak identification in EDS measurements |
| Pearson symbols |
Peltier thermoelectric cooling |
| Peltier mechanical cooling |
Pendellösung/Pendellosung fringes in crystals |
| Penetration/diffusion of elements through grain boundaries |
Penetration depth of energetic incident electrons in materials |
| Penning gauge/(cold cathode) ionization gauge |
Pentagonal Penrose tiling |
| Perfect dislocations |
Perfect/ideal lenses in EMs |
| (Peripheral Component Interconnect) PCI based firewire card |
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| Peripheral electrons removed by objective aperture |
Peripheral electrons emitted from electron guns |
Periodic/step features in HRTEM images |
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HCP Structure at Grain Boundaries in FCC Materials |
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9R structure at grain boundaries in FCC materials |
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Periodic table for analytical
TEM (EDS/EELS) analysis |
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Periodic table for EELS analysis |
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Periodic table for EDS analysis |
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Atomic Weight of Elements in Periodic Table |
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Most Common Crystal Structure of Elements in Periodic Table |
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Alkali metals, Halogens, Transition metals, and Noble Gases in Periodic table |
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Metals, Metalloids, and Nonmetals in periodic table |
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Periodic table of X-ray absorption edges |
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Periodic table for electron affinity |
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Periodic table for atomic & ionic radii and valence states of elements |
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Abundance in Earth's Crust of the elements |
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Periodic table for SIMS measurement |
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Digital Micrograph script to create a periodic table |
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| Permittivity of materials |
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Double perovskite crystalline structures |
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HRTEM imaging of perovskite structures |
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Goldschmidt tolerance factor |
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CaTiO3 |
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Extra electron diffraction spots from perovskite crystalline structures |
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[100] zone axis of perovskite structures |
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Perovskite-like ferroelectrics |
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LaMnO3 |
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Bipolar resistive switching in perovskite insulators |
Phase in EMs |
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Phase of Fourier components in HRTEM images |
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Phase shift of electrons induced by objective lens |
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Phase-contrast in TEM images |
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Phase correlation function (PCF) |
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Phase shift from defocus and spherical aberration |
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Minimum (phase-)contrast in (HR)TEM imaging with Gaussian defocus |
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Maximum (phase-)contrast in (HR)TEM imaging (with Scherzer defocus) |
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Phase object approximation (POA) |
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Phase contrast transfer function/phase distortion function |
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Phase extension procedure |
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Phase-contrast microscopy |
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Phase shift of incident electrons induced by TEM specimen |
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Phase shift of electrons depending on scattering angle in TEM/STEM |
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Scherzer phase plate |
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Beam convergence angle/coherence effects on phase shift |
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Zernike-type phase plate for TEMs |
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Hilbert-type phase plates for TEMs |
Phase of materials |
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Phase identification with XRD and its procedure |
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Crystalline phase analysis by EELS and its plasmon |
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Phase separation in metallic glasses |
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Indexing of crystal structures |
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Phase-induced splitting of reflections in electron diffraction patterns |
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First-order phase transitions |
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First-order ferroelectric phase transitions |
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Second-order phase transitions |
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Shuffle transformation |
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Phase change optical storage media |
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Rewritable phase-change optical memory disks |
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Diffusionless phase transformation |
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Driving force for the phase transition in materials |
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Martensitic transformation |
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Phase transitions inducing ferroelectricity |
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Vibration of atoms/phonon |
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Phonon excitation and thermal diffuse scattering (TDS) of electrons in EMs |
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Phonons formed in EMs versus heating |
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Phonon effect on electron diffraction patterns |
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Phonon effect on TEM imaging |
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Responding time of phonon emission for electron irradiation |
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Broadening of EELS zero-loss peak due to phonon scattering |
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Broadening of diffraction peak & phonon-electron scattering |
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Debye phonon model |
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EDS measurements of phosphorus (P) |
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EELS measurements of phosphorus (P) |
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AlGaInP |
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Compound semiconductor |
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Phosphoric acid (H3PO4) |
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Ni5P2 |
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Phosphine (PH3) |
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P-based metallic-glass alloys |
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| Phosphor used in electron spectrum detectors/cameras |
Photographic plate/photo-film for image recording in EMs |
| Photodiode array (PDA) for EELS |
Photo-diode array (PDA) detectors |
| Photoelectrons |
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Scintillator-photomultiplier (PM) system |
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Responding time of photon emission for electron irradiation |
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Energy/wavelength of X-ray "particles" (photons) |
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Photonic technology |
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Photovoltaic |
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Photovoltaic devices |
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Techniques of physical failure analysis (PFA) for ICs
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Physical gate length |
| Physical and chemical constants, and unit conversion |
Picoammeter |
| Pi (π) bonds |
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Piezo |
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Piezo-controlled energy-selecting slit in EELS device & GIF camera |
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Piezoelectric materials |
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Piezoresponse atomic-force microscopy (PFM) |
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Piezo drive TEM/STEM holders |
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| Pinhole lens for objective lens in SEMs |
Pirani gauge |
| Pipes used in EMs |
Poisson distribution (statistics) |
| Pivot point/rocking point/tilt & shift and their purities in TEM |
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Pixel resolution for recording CBED patterns |
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Pixel size in EM imaging |
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A-, M-, R-, and C-planes of sapphire crystal |
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Cleavage plane of crystals |
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Close packed planes and directions in crystals |
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Determination of Miller indices of planes |
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Plane wave and interference pattern in electron holography |
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Excitation coefficient for plane wave incidence |
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Diffraction of plane wave from multiple point sources |
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Plasma |
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Plasma cleaning and plasma cleaners used for EM sample cleaning |
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Plasma cleaning of FIB prepared specimens |
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Cleaning of hydrocarbon contamination by oxygen radicals in EMs |
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Applications of plasmon mode in EELS for nanostructures |
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Plasmon peaks from thick TEM samples |
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Table of surface & bulk plasmon energy in EELS |
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Plasmon measurement in EELS |
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Surface & bulk plasmon energy in EELS |
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Crystalline phase analysis by EELS plasmon |
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Plasmon mean free path |
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Surface plasmons formed in thin specimen in EMs |
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Maximum intensity of plasmon energy loss peak |
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Interband plasmon peak energy |
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Plasmon signal affected by core-loss transitions in EELS |
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Number of valence electrons involved in plasmon scattering |
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Analysis of surface plasmon resonances affected by energy resolution |
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Cross section of plasmon scattering |
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Sample thickness determination using EELS/FETEM |
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Origin of change of plasmon energy |
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Plastic deformation of metallic glasses
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Free volume change in amorphous materials induced by deformation |
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EDS measurement of platinum (Pt) |
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EELS measurement of Platinum (Pt) |
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Platinum Deposition by FIB |
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Amorphization of STO induced by e-beam Pt deposition |
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FePt alloys |
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Platinum in ICs |
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PtSi in ICs |
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Pt-based metallic-glass alloys |
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| Plural/multiple scattering of electrons |
Pneumatic apertures |
Pnicogen |
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Intermetallic compounds between 3d transition metal and pnicogen |
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| Point ROI on Gatan DigitalMicrograph |
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Point |
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Number of lattice points (atoms) per unit cell |
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Point resolution in EMs |
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Point-spread and its function |
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Lattice point/motif/basis |
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Detection of point defects |
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Saturation of point defects |
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Frenkel pair |
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Point defects created in FIB-EM sample preparation |
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Atomic point defects |
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Electronic point defects |
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Point defects (vacancy & interstitial) generated in Ar-milling |
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Holohedral point groups |
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Merohedral point groups |
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Crystallographic point group notations/description |
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Determination of point group |
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Determination of point groups of cubic systems |
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Point groups of crystals of biological macromolecules |
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Polar point groups for ferroelectricity |
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Relationship between diffraction group and point group |
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| Polar net |
Polar point groups for ferroelectricity |
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Angle between two planes/plane normals/poles measured by Wulff net |
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Nonuniform magnetic properties of pole-piece material |
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Objective polepiece in EMs |
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Polepiece in magnetic prism of energy filters |
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Upper-/lower-objective polepiece in TEMs |
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Pole piece gaps in EM systems |
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Effect of configuration of objective polepieces on STEM/TEM spatial resolution |
Polycrystalline materials |
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Electron diffraction patterns of polycrystalline materials |
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Polysilicon and diffused resistors |
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Polycrystalline silicon in ICs |
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Polycrystalline silicon in solar cells |
Polymer |
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Analytical investigations of polymer |
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TEM specimen grids for EDS analysis |
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Polymer TEM sample preparation |
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| Polytype layer compounds |
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| Portable/desktop/tabletop SEM |
Popup windows and input dialogs of scripts for DM |
| Positive (cathode) & negative (anode) electrode materials for lithium batteries |
Position effects of TEM sample |
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Sample location in TEM system |
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Location of EELS spectrometers in TEM system |
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Position of EDS detector in EMs |
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Position and length of aberration correctors |
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| Post-column energy filters & spectrometers |
Post-fields of objective lens |
Potassium (K) |
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EDS measurement of potassium (K) |
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EELS of potassium (K) |
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K2O·7Nb2O5 crystals |
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Seignette salt/Rochelle salt (NaKC4H4O6•4H2O) |
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Potassium hydroxide (KOH) etching
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Potential |
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Periodic potential of crystals |
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Effect of periodic potential of crystal on STEM imaging |
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Fourier coefficients of electrostatic potential |
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Power |
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High power devices (of ICs) |
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Low standby power devices |
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Power spectra of bright-field (BF) TEM micrographs |
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Power-law fit: a background fitting model |
Power supply |
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Electron-gun high-voltage power supply in EMs |
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Power supplies for quadrupole/octupole aberration correctors |
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Comparison between conventional electron diffraction and PED, and PED applications |
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Diffraction intensity in precession electron diffraction |
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Kinematical effects of PED (precession electron diffraction) |
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Dynamical effects of PED (precession electron diffraction) |
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Precession electron diffraction applications on nanostructures |
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| Precision of measurements |
Precipitation of transition metals |
| Precursor gases used in ion-beam/FIB/electron-beam induced depositions |
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Preferential phenomena |
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Preferential electron-beam etching of grain boundaries |
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Preferential destruction of multilayers in FIB milling |
Pre-field in EMs |
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Objective pre-field lens |
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| Pressurized air for EM parts |
Prewitt edge filter (operator) |
| Prices of EM and related system and services |
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Energy dissipation of primary electrons (PE) in materials |
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Maximum ranges of primary electron beam in EMs |
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Dependence of dopant contrast in Si on accelerating voltage of PE |
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| Primitive great circle in electron stereographic projection |
Primitive (P) lattices |
| Primitive unit cell determination by electron diffraction |
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Prisms |
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Möllenstedt–Düker biprisms in optical and electron microscopes |
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EELS detector/spectrometers |
Probability |
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Probability of containing m atoms in a single atom column in crystal |
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Cross section (probabilities) of electron scattering (Introduction: Elastic & Inelastic) |
Probes in mechanical, electron and ion systems |
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Mechanical, electron and ion probe diameters |
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Probe in EMs |
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Probe-forming/objective aperture for STEM imaging |
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Lenses for fine probe/beam formation in EMs |
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Probe-forming aperture in EMs |
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Electron-probe intensity distribution depending on aberrations |
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Wave function of focused probe in STEM/SEM |
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Probe current in EMs |
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Probe current density |
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Probe current measurement with Faraday cage in EMs |
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Measurement of electron probe current with EELS spectrometer |
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Probe current affected by aberration corrections |
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Measurement of probe current |
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Evaluation of probe size in EMs |
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Probe diameter in EMs |
Procedures |
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Phase identification procedure by CBED |
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CBED Operation Procedure |
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| Probe-forming Cs-corrector |
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Processing |
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EM image processing and deconvolution |
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TEM image formation process |
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| Processes and mechanisms of secondary electron generation |
Profile analysis in integrated circuits (IC) |
| Profile function on Gatan DigitalMicrograph |
Program and software examples for EM-related simulations |
| Projected potential model for TEM specimens |
Projection-diffraction symmetry |
| Publication number related to electron microscopes per year |
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Projector lenses & camera lengths in TEMs |
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Projector crossover |
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Projector lenses and image/diffraction distortion in EMs |
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Projector Lens Alignment (PLA) |
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Back focal plane of projector lens in TEM |
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Properties |
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Semiconductor properties |
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Nonuniform magnetic properties of pole-piece material |
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| Propane torch for EMs |
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Proteins |
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Electron crystallography of proteins |
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| Proximity effect in lithography |
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Pseudo-binary systems |
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Pseudo-binary system Nb2O5/WO3 |
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| Pseudo-weak phase-object approximation |
Pulsed thermally induced voltage alteration (TIVA) |
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Comparison between common pumps used in EMs |
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Vacuum range/efficiency & pump combination |
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Roughing pumps |
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Oil-diffusion Pump |
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Silicon oils from diffusion pump |
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Sputter ion pump (SIP) |
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Classification of vacuum pumps |
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Rotary vacuum pumps |
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Diffusion pumps |
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Turbo-molecular pump (TMP) |
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Rotary vacuum pumps |
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Scroll vacuum pumps |
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Turbo-molecular pump (TMP) |
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Turbomolecular pump |
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Cryopump/cold traps for vacuum & cryogenic (adsorption) pumps |
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Ion getter pumps |
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Cryopump/cold traps for vacuum & cryogenic (adsorption) pumps |
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| Purchase/buy/sales/service of EM systems |
Pyroelectric materials |
| Python |
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