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Ti-W alloy
- Practical Electron Microscopy and Database -
- An Online Book -
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http://www.globalsino.com/EM/
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This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
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Table 2004. Metallization selections in ICs.
Application |
Selection |
Gates, interconnection, and
contacts |
Polysilicon, refractory metal silicides (e.g. MoSix, TaSix, WSix, and TiSix), nitrides, aluminum, copper, and/or refractory metals. |
Diffusion barrier layer |
Ti, TiN, Ta, TaN, Ti-W alloy, and/or silicides |
Top level |
Aluminum, and/or copper |
Metallization
on silicon |
Silicides, tungsten, aluminum, and/or copper |
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