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Chlorine-induced Corrosion/Contamination in ICs
- Practical Electron Microscopy and Database -
- An Online Book -
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https://www.globalsino.com/EM/
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This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
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Chlorine contamination can induce corrosion in semiconductor fabs. The contamination sources are some Cl-based gases such as Cl2, HCl and BCl3, or chemicals used in fabrication flows or chemicals in the fabrication environment. Chlorine reacts with some elements immediately and forms the corrosive products. For instance, it is very common that chlorine reacts with Al element by,
Al3+ + 3Cl- = AlCl3 ----------------- [2044]
The AlCl3 is water soluble products.
Table 2044. Chlorine contamination in IC devices.
Contaminated area |
Contaminant |
Contamination sources |
Effects |
Bond-pad |
Chlorine |
Introduced through top
metal etch or pad etch process |
Induce non-sticking bond pad |
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The book author (Yougui Liao) welcomes your comments, suggestions, and corrections, please click here for submission. If you let book author know once you have cited this book, the brief information of your publication will appear on the “Times Cited” page.
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