Examples of FIB Specifications
- Practical Electron Microscopy and Database -
- An Online Book -


This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.


Table 2476a. Examples of FIB specifications.

Ion source
Ga+ liquid metal ion source (LMIS)
Spatial resolution
4~7 nm @ 30 kV
Pixel resolution
512 x 442, 1024 x 884, 2048 x 1768, 4078 x 1254

Image processing

Pixel averaging, frame/line averaging and integration
Accelerating voltage
1 to 30 kV
30 X (for wide view)
100 X to 500k X
Beam current
<0.1 pA - 50 nA
Current density
10 Acm-2
Working distance
5~7 mm
Sample navigation
5-axes motorized x-y-z-rotate-tilt stage
x and y-axis
≤100 mm
20-43 mm
Stage repeatability in x,y
0.5 µm
Tilt range
-10 to 60 degrees
360 continuous
Flip stage

Stores six TEM half-grids, tilts through 150 degrees to allow samples to be oriented for milling and for STEM imaging.

Minimum Dwell Time
50 ns/pixel
Electronic scan rotation
n x 360 degrees
Beam blanking speed
< 100 ns
Chamber: Everhart-Thornley type SE detector
Secondary ions detector
In-lens: High efficiency annular type SE detector
Chamber: IR-CCD cameras
Chamber: BSE detector
Chamber: BF/DF STEM detector
Image processing
Pixel averaging, frame averaging, continuous averaging
Gas injection
Up to 2 different solid state precursors and 4 different gaseous or liquid precursors: Deposition of Pt, W, C, and/or silicon oxide; Etching with F- and H2O based gas precursors
Milling, deposition, and maskless lithography: To special problems, but is not suited for mass production
System control
User interface based on Windows operating system, controlled by mouse, key board, joystick and control panel
Space requirement

Footprint: 2.3 m x 2.7 m; Working area: 2.7 m x 3.8 m

Table 2476b. Examples of SEM specifications in FIB.

Electron source
Schottky Field Emission Gun (SFEG); Thermal field emission type
Acceleration voltage
0.1 - 30 kV
Probe current
4 pA - 50 nA
20 x - 900k x
Image processing
Pixel averaging, frame averaging, continuous averaging
Resolutions /
5.5 nm @ 0.5 kV
2.5 ~ 3.0 nm @ 1 kV
2.0 nm @ 5 kV
1.1 nm @ 20 kV
1.1 ~ 3.0 nm @ 30 kV
Secondary Electron Detector (SED)
Back Scatter (BS) detectors
Energy dispersive X-ray spectroscopy (EDS) detector





The book author (Yougui Liao) welcomes your comments, suggestions, and corrections, please click here for submission. If you let book author know once you have cited this book, the brief information of your publication will appear on the “Times Cited” page.