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Bevel Dry Etch - Integrated Circuits and Materials - - An Online Book - |
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| Integrated Circuits and Materials http://www.globalsino.com/ICsAndMaterials/ | ||||||||
| Chapter/Index: Introduction | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | Appendix | ||||||||
================================================================================= Poly-silicon residues in the form of needle-shaped defects as shown in Figure 2270a can be successfully removed by bevel dry etch.
Figure 2270a. SEM images of poly-silicon residues at wafer bevel. [1] ============================================
[1] Oguz Yavas, Ernst Richter, Christian Kluthe & Markus Sickmoeller, Wafer-edge yield engineering in leading-edge DRAM manufacturing, Wafer Processing, (2002).
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