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Front End of Line (FEOL)
- Integrated Circuits and Materials - - An Online Book - |
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| Integrated Circuits and Materials http://www.globalsino.com/ICsAndMaterials/ | ||||||||
| Chapter/Index: Introduction | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | Appendix | ||||||||
================================================================================= Figure 2356a. BEOL (copper interconnect layers) and FEOL (transistor level). In the IC (integrated circuits) process, transistors are manufactured on a wafer in a fab, where the front-end-of-the-line (FEOL) is. And then, the interconnects and MOL (middle-of-line) layers are produced in a separate fab facility called the backend-of-the-line (BEOL). The transistor structure and interconnects are the MOL, which consists of a series of tiny contact structures.
Figure 2356a. BEOL and FEOL. [1]
Figure 2356b. BEOL and FEOL. [2] ============================================
[1] https://semiengineering.com/breaking-the-2nm-barrier/.
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