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There are several companies that are known to use Flip Chip-CSP (FC-CSP) technology in their products. It's important to note that the landscape of FC-CSP adoption can change over time, and new companies may adopt this technology while others may shift their packaging strategies. Here are some notable companies that have utilized FC-CSP in their products in the past or are known for adopting this packaging technology:

1. Apple: Apple has been using FC-CSP in its mobile devices, such as iPhones and iPads, to achieve compact form factors and high-performance packaging.

2. Qualcomm: Qualcomm, a leading semiconductor company, has incorporated FC-CSP in its system-on-chip (SoC) designs used in mobile devices and other consumer electronics.

3. Samsung: Samsung has employed FC-CSP technology in various products, including their mobile devices, wearables, and other consumer electronics.

4. MediaTek: MediaTek, a semiconductor company specializing in mobile device chips, has utilized FC-CSP in their chipsets for smartphones and tablets.

5. Intel: Intel has adopted FC-CSP technology in certain processors and chipsets for improved performance and thermal management.

6. Texas Instruments: Texas Instruments (TI) has employed FC-CSP in certain semiconductor devices used in applications like wireless communication, automotive, and industrial.

7. Nvidia: Nvidia, known for its graphics processing units (GPUs), has incorporated FC-CSP in some of its high-performance chips used in gaming, artificial intelligence, and data centers.

8. Broadcom: Broadcom has used FC-CSP in various semiconductor solutions, including networking, wireless communication, and storage products.

Note that this list is not exhaustive, and other companies may also utilize FC-CSP technology in their products. Additionally, the adoption of FC-CSP may vary across different product lines and generations within these companies. It's always a good idea to refer to specific product specifications or official announcements from the companies themselves for the most accurate and up-to-date information on their packaging technologies.

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