Poisson Yield Model (with Random-and-not-Clustered Defects/Fails) - Integrated Circuits and Materials - - An Online Book - |
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| Integrated Circuits and Materials http://www.globalsino.com/ICsAndMaterials/ | |||||||||||||||||||||||||||||||||||
| Chapter/Index: Introduction | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | Appendix | |||||||||||||||||||||||||||||||||||
================================================================================= Early yield models in integrated circuit (ICs) fabrication have been based on the Poisson distribution, but these have turned out to be inadequate, underestimating the yield for large chips. [2] If the distribution of the defects/fails is random, and not clustered, then Poisson model can be used. In this case, it can be assumed that the distribution of fails (faults) is random and the
occurrence of a fail (fault) or at any location is independent of the occurrence of any
other fault (fail). For a given µ, the fail probability that a die contains k defects is, [1] Figure 4305 shows the plotted fail probability as a function of µ. Since the yield is equivalent to the probability that the chip contains no defects, the yield can be given by,
As an example, assuming a single IC chip has an average of 0.001 faults per die, if the Poisson
yield model of Equation 4305b is applied, and the yield of a die with 500 of these ICs is
equal to, Table 4305 shows estimated yield for 0 = 0.5, 1.0, 2.0, ∞ with different yield models.
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[1] Way Kuo, Wei-Ting Kary Chien and Taeho Kim, Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development, 1998.
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