Microanalysis Methods


Analysis Techniques

Online Book: Practical Electron Microscopy and Database
XPS quantitative analysis
Introduction of X-Ray Photoelectron Spectroscopy (XPS)
Photoluminescence and Electroluminescence
K Series X-Ray Wavelengths
penetration depths of ions
Comparison of Scanning Ion Microscopy and Scanning Electron Microscopy Imaging
UPS process
Summary of core level binding energies below 1100 eV (XPS)
Schematic view of XPS
Schematic view of several electron spectroscopies (XPS, UPS, Auger and Inverse Photoemission)
Schematic view of a concentric hemispherical analyzer (CHA)
Schematic representation of the decay of a core-excited state in participator and spectator channels
Schematic figure of the Soft X-ray Absorption (S-XAS) process
Schematic diagram showing the sign of surface core level shifts for transition metals (XPS)
Relative Auger sensitivities at Ep=3 keV
Potential wells in a diatomic potential (S-XAS)
IPES (Inverse photoelectron spectroscopy)
Energy level diagram of the XPS experiment
Electron attenuation length versus kinetic energy
determination of work function using electron spectrometer
Core level shifts for 5d and 4d transition elements
Chart of Auger peaks (Principal Auger Electron Energies)
Born-Haber cycle for the core excitation of an electron in a metal (XPS)
Bohr Model, One-electron Energy Diagram and Many-body Diagram of Photoionization, Shake-up, X-ray Emission and Auger
Auger vs. photon yield as function of Z
Auger System Components
Auger process
Setup of SCM (Scanning capacitance microscopy) system
Experimental setup for SKPM measurements scanning Kelvin probe microscopy
Specimen Interaction Volume during Microanalysis
Electron Material (Specimen) Interaction in Microanalysis
Operating Parameters of Four Types of Electron Sources
Principle of FESEM
Quantitative Electron Probe Microanalysis
EDX - Energy Dispersive X-ray Analysis
Energy Dispersive X-ray Detector
Limiting factors of EDS (Energy Dispersive X-ray Spectroscopy)

Overview of Analytical Techniques for Dopant Evaluation and Structural Characterization

1. Structural Characterization

      1.1. Point Defect Evaluation
           Chemical etching technique
           Scanning capacitance microscopy
           Deep-level transient spectroscopy

      1.2. Evaluation of Dislocation and Other Defects
           Electron microscopy
           Chemical etching techniques

2. Dopant and Impurity Evaluation

      2.1 Methods Based on Chemical Techniques
           Transmission electron microscopy
            Atomic force microscopy
            Scanning electron microscopy

      2.2. Methods Based on Electrical Techniques
           Capacitance-voltage technique and SCM
           Spreading resistance profiling and SSRM

      2.3. Secondary Ion Mass Spectroscopy

      2.4. Scanning Electron Microscopy

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