Electron microscopy
  
Current Density Threshold Causing Electromigration
- Practical Electron Microscopy and Database -
- An Online Book -
Microanalysis | EM Book                                                                                   http://www.globalsino.com/EM/        


=================================================================================

 

Table 998. Current density threshold causing electromigration.

Materials Temperature
Current density threshold
A/cm2 nA/nm2
SnPb solder
100°
8.5 x 103 [1]
8.5 x 108
SnAgCu
  
104 [3]
109
Al film
 
1.6 x 105[5]
1.6 x 1010
Pb-5%Sn
  
4.5 x 103[4]
4.5 x 108
Cu
  
106 [3]
1011
Al film
< 200°
105 [2]
x 1010

 

 

 

 

 

 

 

 

 

 

 

 

 

[1] Y. T. Yeh, C. K. Chou, Y. C. Hsu, Chih Chen, K. Tu, Threshold current density of electromigration in eutectic SnPb solder, Appl. Phys. Lett. 86, 203504 (2005).
[2] H.-U.Schreiber, Electromigration threshold in aluminum films, 28, 6, 617-626 (1985).
[3] Sadia Khan, Electromigration Analysis of High Current Carrying Adhesive-Based Copper-to-Copper Interconnections, thesis, (2012).
[4] Abraham H. Landzberg, Microelectronics Manufacturing Diagnostics Handbook, 1993.
[5] K. N. Tu, Recent advances on electromigration in very-large-scale-integration of interconnects, Applied Physics Reviews, (2003).

 

 

 

 
=================================================================================