Nitrides
- Practical Electron Microscopy and Database -
- An Online Book -

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This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
 

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Table 2007a. Metallization selections in ICs.

Application
Selection
Gates, interconnection, and
contacts
Polysilicon, refractory metal silicides (e.g. MoSix, TaSix, WSix, and TiSix), nitrides,aluminum, copper, and/or refractory metals.
Diffusion barrier layer
Ti, TiN, Ta, TaN, Ti-W alloy, and/or silicides
Top level
Aluminum, and/or copper
Metallization on silicon
Silicides, tungsten, aluminum, and/or copper

Table 2007b. Important nitrides in alloy engineering.

Chemical element

Main nitrides
Aluminum
AlN
Boron
BN
Chromium
CrN
Cr2N
Hafnium
HfN
Hf3N2
Hf4N3
Iron
Fe4N
Fe2N
Magnesium
Mg3N
Manganese
Mn4N
Mn2N
Mn3N
Molybdenum
MoN
Mo2N
Niobium
NbN
Nb2N
Nb4N3
Silicon
Si3N4
Tantalum
TaN
Ta2N
Ta3N5
Titanium
TiN
Ti2N
Tungsten
WN
W2N
Vanadium
VN
V2N
Zirconium
ZrN

 

 

 

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