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Table 2007a. Metallization selections in ICs.
Application |
Selection |
Gates, interconnection, and
contacts |
Polysilicon, refractory metal silicides (e.g. MoSix, TaSix, WSix, and TiSix), nitrides,aluminum, copper, and/or refractory metals. |
Diffusion barrier layer |
Ti, TiN, Ta, TaN, Ti-W alloy, and/or silicides |
Top level |
Aluminum, and/or copper |
Metallization
on silicon |
Silicides, tungsten, aluminum, and/or copper |
Table 2007b. Important nitrides in alloy engineering.
Chemical element |
Main nitrides |
Aluminum |
AlN |
|
|
Boron |
BN |
|
|
Chromium |
CrN |
Cr2N |
|
Hafnium |
HfN |
Hf3N2 |
Hf4N3 |
Iron |
Fe4N |
Fe2N |
|
Magnesium |
Mg3N |
|
|
Manganese |
Mn4N |
Mn2N |
Mn3N |
Molybdenum |
MoN |
Mo2N |
|
Niobium |
NbN |
Nb2N |
Nb4N3 |
Silicon |
Si3N4 |
|
|
Tantalum |
TaN |
Ta2N |
Ta3N5 |
Titanium |
TiN |
Ti2N |
|
Tungsten |
WN |
W2N |
|
Vanadium |
VN |
V2N |
|
Zirconium |
ZrN |
|
|
Table 2007c. Nitride parameters.
Nitrides |
Electrical resistivity (µΩ-cm) |
Dielectric constant (K) |
Band gap (eV) |
Conduction band offset on Si (eV) |
Superconductive transition temp (K) |
Magnetic susceptibility
(emu/mol) |
Density gm/cm3 |
Room Temp. Fracture Toughness MPa. m1/2 |
Hall constant (cm3/A•s) |
Thermal expansion (ppm/°C) |
Thermal conductivity (W/m·°C) |
Specific heat (Cp, J/mol•K) |
Debye Temp.
(K) |
Melting point (°C) |
Heat of Formation (-ΔHf) at 298 K (kJ/g-atom metal) |
Crystal Structure |
Lattice constant (nm) |
Space group |
Pearson symbol |
Molecular weight |
Flexural strength (MPa) |
Poisson's ratio |
Vickers hardness (GPa) |
Young's modulus (GPa) |
Modulus of elasticity (GPa) |
Friction coefficient |
Transverse rupture strength (MPa) |
Index of refraction (3 eV) |
Max working temp (°C) |
Oxidation resistance |
Chemical resistance |
Color |
Properties |
Major applications |
| AlN |
1019 |
8.9 |
6.2 |
|
|
|
3.257 |
|
|
Δa/a=4.2
Δc/c=5.3 |
Polycrystal: 200
Single crystal: 320 |
|
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Wurtzite |
a = 0.3112; c = 0.4982 |
|
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0.24 |
18-25 |
|
260-350 |
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|
2.15±0.05 |
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| AlN |
|
|
5.11 |
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4.2-4.3 |
140-230 |
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Zinc blende |
a = 0.438 |
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|
343-390 |
|
12 |
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2.15±0.05 |
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| BN |
|
4.1 |
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3.7 |
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40 |
660 |
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| CrN |
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10.3 |
84 |
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1810 |
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11 |
400 |
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0.4-0.5 |
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600-700 |
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Silver-gray |
Good adhesion; good corrosion; good oxidation resistance |
Machining copper; metal forming; plastic molding |
| HfN |
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Yellow-green |
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| NbN |
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10.1 |
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|
2204 |
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14 |
480 |
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| Si3N4 |
|
6.0-7.0 |
5.3 |
2.4 |
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|
3.27 |
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3.0 |
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100 |
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| TaN |
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Yellow-silver |
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| TiAlN |
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0.4 - 0.7 |
|
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700-800 |
800 °C |
|
Violet-gray |
Excellent oxidation resistance |
A multi-layer coating designed for a wide range of carbide and high speed steel tooling; excellent for machining cast iron, stainless steel, nickel-based high temperature alloys and titanium alloys; designed for high speed and semi-dry or dry machining operations |
| TiAlCN |
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600 °C |
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| TiCxNy |
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|
8 |
20-30 |
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24.5-29.4 |
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|
0.3 - 0.4 |
|
|
400-450 |
400 °C |
|
Blue-grey |
High hardness; good wear resistance; enhanced toughness; high lubricity; stable and inert stable lubricant |
Mechanically stressed cutting; high speed cutting |
| TiN |
|
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|
9.4 |
29 |
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|
2949 |
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20 |
440 |
|
0.4-0.5 |
|
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550-600 |
600 °C |
|
Yellow-golden to gray-silver |
|
Machining of iron-based materials; metal forming; plastic molding |
| TiN/AlN |
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950 °C |
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TiNx
(x = 0.6 to 1.1) |
20±10 |
|
|
|
5.6 |
+38x10-6 |
5.40 |
2950 |
-0.7±0.2 x 10-4 |
9.35 |
11-67 |
33.74 |
636 |
|
338 |
fcc B1 (NaCl) |
0.424 |
Fm3m |
cF8 |
61.87 |
|
0.25 |
18-40 |
|
251-450 |
|
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|
Chemical stable at room temperature. Slowly attacked by concentrated acid solution with rising temperature |
Begins to oxidize in air at approximately 800 °C |
Gold |
|
Electrode
|
| Ti3AlN |
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Cubic |
0.41121 |
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| Ti3Al2N2 |
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0.29875 |
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Ti2N |
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Tetragonal |
a = 0.4945; c = 0.3034 |
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| Ti3N1.29 |
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Rhombohedral |
a = 0.2980; c = 2.1664 |
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| VN |
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8.0 |
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15 |
460 |
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| WN |
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400 |
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| ZrN |
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Pale golden |
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| Zr(CxN1-x) (for x = 0.05~0.20) |
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Golden |
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