Thermal Stress for Test of Reliability and Long-term Failure in ICs
- Practical Electron Microscopy and Database -
- An Online Book -

http://www.globalsino.com/EM/  



 
This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
 

=================================================================================

A thermal stress can be used to test the reliability and long-term failure in integrated circuit (IC) technologies, for instance, this test can be carried out at 450 °C over 4 hours.

 

 

=================================================================================

The book author (Yougui Liao) welcomes your comments, suggestions, and corrections, please click here for submission. You can click How to Cite This Book to cite this book. If you let Yougui Liao know once you have cited this book, the brief information of your publication will appear on the “Times Cited” page.



 
 
 
Copyright (C) 2006 GlobalSino, All Rights Reserved