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Table 2026a. Properties of copper (Cu).
Resistivity (10-6 Ω•cm) |
1.67 |
|
Corrosion in air |
Poor |
Melting point (°C) |
1085 |
|
Specific heat capacity(Jkg-1K-1)
|
380 |
Thermal conductivity (Wcm-1) |
3.98 |
|
|
Poor |
Thermal stress per degree for
films on silicon (107 dyn cm-2 °C-1) |
2.5 |
|
Youngs modulus
(10-11 dyn cm-2)
|
12.98 |
Work Function (eV) |
4.65 |
|
|
1.90 |
Coefficient of thermal expansion (CTE)
(10-6 °C-1) |
17 |
|
Density (g-cm-3) |
8.96 |
Heat conductivity (kh,Wcm-1K-1) |
3.94 |
|
Vaporization temperature (Tv, °C) |
2595 |
Melt heat (Qm, J-g-1) |
212 |
|
Vaporization heat (Qv, J-g-1) |
4770 |
Absorption (1-R) |
0.06 |
|
Surface free energy (ergs/cm2) |
850 at 1000 °C |
Electronic configuration |
[Ar] 3d10 4s1 = 1s2 2s2 2p6 3s2 3p6 3d10 4s1 |
|
Crystal system |
FCC |
Kα X-ray for XRD measurements
|
Wavelength (λ) = 0.15418 nm |
|
Oxidation States |
Most common: +1 and +2; some cases: +3 and +4 |
Table 2026b. Some surface energies (J/m2) of low-index surfaces of Cu crystals.
Solid
|
(100)
|
(110)
|
(111) |
(311) |
(511) |
Cu |
1.62 |
1.66 |
1.55 |
1.82 |
1.68 |
Figure 2026a shows the atomic structure of Cu.
![Atomic structure of Al](image1/2026.gif)
Figure 2026a. Atomic structure of Cu.
Figure 2026b shows the solid solubility of some impurities (including Cu) in silicon.
![Solid solubility of impurities in silicon](image2/3228.PNG)
Figure 2026b. Solid solubility of impurities in silicon.
Figure 2026c shows the solubility for impurities (including Cu) in SiC.
![Solubility for impurities in SiC](image2/2089b.PNG)
Figure 2026c. Solubility for impurities in SiC.
Table 2026c. Some copper-based alloys.
Alloys |
Page on EM online book |
Al87Ni7Cu3Ce3 |
page1433 |
|