This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
 

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In general, some types of defects can be identified by in-line metrology, while more cannot due to scaling. Therefore, failure analysis after full fabrication process becomes more important.

Due to the increasing complexity of the integrated circuits, it is not economically efficient to do failure analysis using FIB, SEM, and TEM without other technical assistances because it is too difficult and cost too much time to locate the defective spots.