Copper (Cu)
- Practical Electron Microscopy and Database -
- An Online Book -

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Table 2026a. Properties of copper (Cu).

Resistivity (10-6 Ω•cm)
1.67
Corrosion in air
Poor
Melting point (°C)
1085
Specific heat capacity(Jkg-1K-1)
380
Thermal conductivity (Wcm-1)
3.98
Adhesion to SiO2
Poor
Thermal stress per degree for
films on silicon (107 dyn cm-2 °C-1)
2.5
Youngs modulus
(10-11 dyn cm-2)
12.98
Work Function (eV)
4.65
Electronegativity
1.90
Coefficient of thermal expansion (CTE) (10-6 °C-1)
17  
Density (g-cm-3)
8.96
Heat conductivity (kh,Wcm-1K-1)
3.94  
Vaporization temperature (Tv, °C)
2595
Melt heat (Qm, J-g-1)
212  
Vaporization heat (Qv, J-g-1)
4770
Absorption (1-R)
0.06   Surface free energy (ergs/cm2) 850 at 1000 °C
Electronic configuration
[Ar] 3d10 4s1 = 1s2 2s2 2p6 3s2 3p6 3d10 4s1   Crystal system FCC

Kα X-ray for XRD measurements

Wavelength (λ) = 0.15418 nm  
Oxidation States
Most common: +1 and +2; some cases: +3 and +4

Table 2026b. Some surface energies (J/m2) of low-index surfaces of Cu crystals.

Solid
(100)
(110)
(111)
(311)
(511)
Cu
1.62
1.66
1.55
1.82
1.68

Figure 2026a shows the atomic structure of Cu.

Atomic structure of Al

Figure 2026a. Atomic structure of Cu.

Figure 2026b shows the solid solubility of some impurities (including Cu) in silicon.

Solid solubility of impurities in silicon

Figure 2026b. Solid solubility of impurities in silicon.

Figure 2026c shows the solubility for impurities (including Cu) in SiC.

Solubility for impurities in SiC

Figure 2026c. Solubility for impurities in SiC.

Table 2026c. Some copper-based alloys.
Alloys
Page on EM online book
Al87Ni7Cu3Ce3 page1433

 

 

 

 

 

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