Physical Failure Analysis (PFA) in ICs
- Practical Electron Microscopy and Database -
- An Online Book -

http://www.globalsino.com/EM/  



 
This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
 

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Physical failure analysis (PFA) techniques for ICs are:
        i) Optical microscopes;
        ii) Scanning electron microscopes (SEM) and EDS;
        iii) Focused ion beam (FIB);
        iv) TEM, EDS, and EELS;
        v) RIE dry etch;
        vi) Chemical wet etch (including junction staining);
        vii) Auger;
        viii) SIMS
        ix) XPS
        x) FTIR;
        ix) AFM;
        xii) Parallel lapping tools (die and package level);
        xiii) Wire bonder/reball/decapsulation tools.

 

 

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The book author (Yougui Liao) welcomes your comments, suggestions, and corrections, please click here for submission. If you let book author know once you have cited this book, the brief information of your publication will appear on the “Times Cited” page.