Copper (Cu) Interconnects with Tantalum (Ta) Barrier
- Practical Electron Microscopy and Database -
- An Online Book -

http://www.globalsino.com/EM/  



 
This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.
 

=================================================================================

Figure 2906 shows cross-sectional schematic illustration of Cu (copper) single damascene interconnects with Ta barrier and dielectric diffusion barrier SiCxNy.

Cross-sectional schematic illustration of Cu single damascene interconnects with Ta barrier and dielectric diffusion barrier SiCxNy

Figure 2906. Cross-sectional schematic illustration of Cu single damascene interconnects with Ta barrier and dielectric diffusion barrier SiCxNy. [1]

 

 

 

 

[1] T. Usui, H. Nasu, T. Watanabe, H. Shibata, T. Oki, and M. Hatano, Electromigration diffusion mechanism of electroplated copper and cold/hot two-step sputter-deposited aluminum-0.5-wt% copper damascene interconnects, Journal of Applied Physics 98, 063509 (2005).

 

 

=================================================================================

The book author (Yougui Liao) welcomes your comments, suggestions, and corrections, please click here for submission. You can click How to Cite This Book to cite this book. If you let book author know once you have cited this book, the brief information of your publication will appear on the “Times Cited” page.



 
 
 
Copyright (C) 2006 GlobalSino, All Rights Reserved