This book (Practical Electron Microscopy and Database) is a reference for TEM and SEM students, operators, engineers, technicians, managers, and researchers.

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Schmidt et al. [1] proposed that a particular grain boundary stabilzed Cu (copper) in the boday centered cubic (BCC) structure at an asymmetircal Σ3 tilt grain boundary with <211> rotation axis, even though Cu can mostly be stable in the face-centered-cubic (FCC) structure up to its melting point. Figure 4742 shows a HRTEM image, recorded in the ARM 1250, corresponds to the case of the Σ3 84° <211> boundary illustrated in Figure 4737 (d). According to the combination of their simulation and the HRTEM image, they conclude that the interfacial region (enclosed by the red lines) is formed by BCC structure.

Figure 4742. HRTEM image of Σ3 84° <211> boundary. [1]

[1] C. Schmidt, F. Ernst, M.W. Finnis, and V. Vitek, Phys. Rev. Lett. 75, 2160 (1995).