Practical Electron Microscopy and Database

An Online Book, Second Edition by Dr. Yougui Liao (2006)

Practical Electron Microscopy and Database - An Online Book

Chapter/Index: Introduction | A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | Appendix

Throughput in E-beam Inspection

Figure 5a shows the simulated throughput depending on defect size for E-beam inspection. The relationship between defect size and throughput is generally inverse, meaning smaller defect sizes typically result in lower throughput due to the increased inspection time required.

Multi Beam Inspection Tool from ASML

Figure 5a. Simulated throughput depending on defect size for E-beam inspection.