Chapter/Index: Introduction | A |
B |
C |
D |
E |
F |
G |
H |
I |
J |
K |
L |
M |
N |
O |
P |
Q |
R |
S |
T |
U |
V |
W |
X |
Y |
Z |
Appendix
Thermo Fisher Metrios TEM
| The advantages and disadvantages of Thermo Fisher Metrios TEM for sample preparation and imaging are:
- Advantages
- Automation of TEM Imaging: The use of script-based operations and computer vision for wafer pattern recognition allows for automated processes in TEM preparation and imaging, improving efficiency.
- Efficiency in Specific Applications: The automation has demonstrated enhanced efficiency, particularly in TEM Critical Dimension (CD) metrology applications, highlighting potential use cases where automation is highly effective.
- Higher Throughput and Productivity: When integrated with manually assisted defect registration, the automated FIB setup increases throughput and productivity, showing significant gains in inline defect characterization processes.
- Disadvantages
- Challenges with Defect Location Variability: Due to the random distribution of defects on wafers, the automation process struggles to precisely target defect locations, making precise TEM lamella creation challenging.
- High Cost of Automation Scripts for Varying Defect Locations: Developing automation scripts that can adapt to varying defect locations on a wafer is expensive and labor-intensive, potentially diminishing cost-effectiveness.
- Prone to Human Error: The reliance on conventional pattern recognition in varying defect scenarios can introduce human error, especially in the setup and calibration stages.
- Limited to Visible Defects: The current automated approach primarily works for visible defects, reducing its applicability to defects that are not easily detectable visually.
- Occasional Need for Human Intervention: Despite automation, the process occasionally requires manual intervention, indicating that full automation is yet to be achieved and there’s room for further refinement.
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